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  • 08월 28일 16시 이후 : 초록수정 불가능, 일정확인 및 검색만 가능

New Materials for Printed Electronics

등록일
2008년 8월 22일 21시 05분 53초
접수번호
1590
발표코드
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발표시간
금 10시 : 40분
발표형식
심포지엄
발표분야
고분자화학 - Chemistry for the Success of Plastic Electronics in Markets
저자 및
공동저자
Florian Doetz
BASF Global Research Center, Singapore, Singapore
Additive mass printing of functional electronic materials is considered to provide a powerful path to low-cost manufacturing of integrated transistor circuits. Such a high-speed approach requires successive in-line capable solution deposition of each layer on flexible substrates. Typical strategies reported include printing techniques such as screen and pad printing or ink jet. However, to be useful in mass production the final process must allow high throughput rates and high resolution. Therefore, offset and gravure printing represent attractive deposition techniques since they are commonly used for the production of newspapers and packaging with printing speeds of several m/s. Meeting printing requirements (formulation and rheology of inks, adhesion) and device performance is a key challenge for an efficient production process. We develop different materials classes for CMOS circuits ranging from p- and n-type semiconductors to appropriate dielectrics and their formulation into printable inks. This includes small molecules and polymers. For example, different P3HT grades are already available in larger quantities.

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