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  • 02월 19일 10시 이후 : 초록수정 불가능, 일정확인 및 검색만 가능

대한화학회 제121회 학술발표회 및 총회 Development of novel inorganic compounds for thermal interface materials (TIMs)

등록일
2018년 2월 6일 16시 28분 31초
접수번호
4315
발표코드
INOR.P-92 이곳을 클릭하시면 발표코드에 대한 설명을 보실 수 있습니다.
발표시간
4월 19일 (목요일) 11:00~12:30
발표형식
포스터
발표분야
Inorganic Chemistry
저자 및
공동저자
DONGWOO LEE, Kang Min Ok*
Department of Chemistry, Chung-Ang University, Korea
Thermal management has become a major issue to enhance functionality and performance in many research fields including highly integrated electronic processors, lighting systems, and energy harvesting devices. Among them, thermal interface materials (TIMs) are critical components for efficient electronics cooling factor, where they act by filling unavoidable air gaps between contacting surfaces of heat sources and heat sinks. TIMs are typically composed of thermally conductive fillers and viscous polymer matrix to achieve high thermal conductivity. In particular, the thermal fillers directly affect the heat transfer system; thus, the development of various types of fillers is very important. In this study, various types of thermal fillers have been applied in the form of TIMs and the effects on the thermal properties are presented.
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