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제124회 대한화학회 학술발표회, 총회 및 기기전시회 안내 Synthesis and Thin Film Properties of a Novel Polyimide/Surface Modified TiO₂ Nanocomposite Layer for Solution Processable High k Dielectric

등록일
2019년 8월 19일 15시 26분 09초
접수번호
0401
발표코드
POLY.P-9 이곳을 클릭하시면 발표코드에 대한 설명을 보실 수 있습니다.
발표시간
10월 18일 (금요일) 11:00~12:30
발표형식
포스터
발표분야
Polymer Chemistry
저자 및
공동저자
Kyeongmin Kim, Taek Ahn*
Department of Chemistry, Kyungsung University, Korea
For high performance organic thin film transistors (OTFTs), OTFT require dielectrics having a high dielectric constant and enhanced mechanical stability. In this study, we report on a novel polymer nanocomposite dielectric based on a (3-aminopropyl)triethoxysilane (APTES) functionalized titanium dioxide (TiO₂) nanoparticle as a dopant in crosslinkable polyimide (PI). Firstly, the hydroxyl group containing polyimide (DOCDA-6FHAB) polymer was synthesized through a simple one step condensation polymerization using the monomers, 5-(2,5-dioxytetrahydrofuryl)3-methly-3- cyclohexene-1-2-dicarboxylic anhydride (DOCDA) and 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FHAB). And then, we introduced the titanium dioxide (TiO₂) nanoparticle to make a high dielectric constant polyimide nanocomposite dielectric. To avoid the large leakage current and low breakdown strength, control over the particle-particle interaction and particle-polymer interface is essential. Thus, approaches to modify nanoparticles via robust chemical bonds are highly desirable. Therefore, the surface of titanium dioxide (TiO₂) was modified by (3-aminopropyl)triethoxysilane (APTES) to increase the interfacial adhesion between polyimide and nanoparticle. In addition, we used crosslinked DOCDA-6FHAB as capping layer on polyimide nanocomposite layer to further improve leakage current and surface roughness. Polyimide nanocomposite was systematically characterized such as chemical structures, surface roughness, surface energy, and capacitance, etc. Polyimide nanocomposite bilayer film showed high dielectric constant (5.51) and low leakage current density (10‾⁷ A/cm²) in metal-insulator-metal (MIM) devices. Detailed synthetic routes of polyimide and nanocomposite film fabrication condition will be presented.

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