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  • 09월 10일 16시 이후 : 초록수정 불가능, 일정확인 및 검색만 가능

제124회 대한화학회 학술발표회, 총회 및 기기전시회 안내 Construction of substrate PI property analysis process applied to flexible OLED.

2019년 8월 29일 16시 52분 15초
ANAL.P-170 이곳을 클릭하시면 발표코드에 대한 설명을 보실 수 있습니다.
10월 18일 (금요일) 11:00~12:30
Analytical Chemistry
저자 및
Ji Sun Kim
Chemical analysis technology team, LG Display, Korea
Recently, as the need for 'flexible displays' using light and flexible plastic substrates instead of conventional glass-based displays is increasing, competition in R&D and industrial production by country and enterprise is fierce. In addition, OLED made of organic materials that emit light without backlight have been actively developed as flexible displays due to excellent flexibility. These flexible displays are wholly dependent on the substrate and in the case of transmissive displays, not only flexibility but also optical clarity are important factors. In order to develop a substrate, it is important to understand the required properties of the plastic substrate used and to select a polymer materials. Development of transparent plastic substrates for flexible displays has been in progress since the late 1990s, and nowadays, polyimide (PI), which can show the thermal characteristics of glass level, is commercially used as the sole substrate of the flexible display. PI has the advantages of superior elasticity, impact resistance and light transmittance and it has chemical resistance, abrasion resistance, and heat resistance and stability to external stimulation. In addition to the above, there are advantages such as excellent mechanical and electrical properties. The purpose of this study is to evaluate the properties of PI films to derive material management items, to secure material stability through periodic monitoring, and to analyze the correlation among material companies. To assess the overall properties of PI, various analytical techniques were used. As a result, we will support the evaluation of the mass production process, manage the items to identify and improve the cause of defects, and establish a comprehensive PI substrate analysis process.