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대한화학회 제124회 학술발표회 및 총회 Reversible surface chemistry to assemble microchips on the hole array in solution

등록일
2019년 8월 29일 17시 44분 44초
접수번호
1914
발표코드
MAT.P-393 이곳을 클릭하시면 발표코드에 대한 설명을 보실 수 있습니다.
발표시간
10월 17일 (목요일) 11:00~12:30
발표형식
포스터
발표분야
Material Chemistry
저자 및
공동저자
Yong Duk Kim, Dongkwon Lim*
KU-KIST Graduate School, Korea University, Korea
Industrially, it is useful to apply chemical reactions that can assemble, combine, and separate micro-sized chips onto a substrate or panel. We applied chemical reactions to assemble, bonding, and maintain microchips on surface-treated substrates, which could be confirmed that the chip remains in the bonded state. After the microchips were assembled, bonded, and maintained on the surface-treated substrate, the separation reaction was performed by using light and chemicals. Especially, synthesized UV-cleavable compound can be chemically decomposed by UV, which is a simple, efficient, and cost-effective method in solution based. The chips binding will proceed quickly and the assembly of the chips efficiently in a solution based chemical reaction. Unlike conventional processes, microchips are combined and separated in solution based and have the potential to be applied to various industries (e.g. display industry).

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