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  • 03월 07일 12시 이후 : 초록수정 불가능, 일정확인 및 검색만 가능

Development and Characterization of Nanostructured Interfaces for Electrochemical Applications

2007년 2월 28일 11시 47분 46초
목18E4심 이곳을 클릭하시면 발표코드에 대한 설명을 보실 수 있습니다.
목 15시 : 30분
재료화학 - 1st Korea-UK Chemistry Workshop: Nanostructured Materials
저자 및
Patrick R. Unwin
Electrochemistry and Interfaces Group, University of Warwick,
Nanostructured electrode surfaces offer tremendous prospects for improving the sensitivity and selectivity of electrode processes, with potential benefits in electroanalysis and electrocatalysis. At Warwick, our interests and expertise are broadly two-fold. First, we are creating novel functionalised interfaces, based on single-walled carbon nanotubes (SWNTs), metal nanoparticles (NPs) and ultrathin films, in various combinations, that can be fabricated and studied in a reproducible fashion. These represent platforms for the development of new functionalized electrode surfaces. Second, we are developing and applying a range of techniques to understand and optimize these interfaces and their properties at high resolution, including scanning electrochemical microscopy (SECM) [1], atomic force microscopy (and several electrical variants), scanning laser confocal microscopy [2] and Raman microscopy. We have a particular interest in wired two-dimensional networks of SWNTs which typically cover only 1% of a surface, yet behave like a continuous film in voltammetric experiments [3]. SWNT networks may also serve as templates for the controlled electrodeposition of wired NPs [4,5]. NPs of this type and arrays of NPs on various supports, including ultrathin polymeric films, are being explored for electrocatalytic applications [6]. 1. See for example: P. Bertoncello et al, Langmuir, 2006, 22, 10380. 2. See for example A. L. Colley et al, Anal. Chem. 2006, 78, 2539. 3. N. R. Wilson, et al, Anal.Chem., 2006, 78, 7006. 4. T. M. Day et al, J. Am. Chem. Soc., 2005, 127, 10639. 5. T. M. Day et al, Nano Lett., 2007, 7, 51. 6. See for example A. P. O’Mullane et al, Chem. Comm. 2004, 1606.