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|
| Type |
Poster Presentation |
| Area |
Inorganic Chemistry |
| Room No. |
Event Hall |
| Time |
4월 19일 (목요일) 11:00~12:30 |
| Code |
INOR.P-92 |
| Subject |
Development of novel inorganic compounds for thermal interface materials (TIMs) |
| Authors |
DONGWOO LEE, Kang Min Ok*
Department of Chemistry, Chung-Ang University, Korea
|
| Abstract |
Thermal management has become a major issue to enhance functionality and performance in many research fields including highly integrated electronic processors, lighting systems, and energy harvesting devices. Among them, thermal interface materials (TIMs) are critical components for efficient electronics cooling factor, where they act by filling unavoidable air gaps between contacting surfaces of heat sources and heat sinks. TIMs are typically composed of thermally conductive fillers and viscous polymer matrix to achieve high thermal conductivity. In particular, the thermal fillers directly affect the heat transfer system; thus, the development of various types of fillers is very important. In this study, various types of thermal fillers have been applied in the form of TIMs and the effects on the thermal properties are presented. |
| E-mail |
bettle1818@hanmail.net |
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121st General Meeting of the KCS