|
Type |
Poster Presentation |
Area |
Industrial Chemistry |
Room No. |
Event Hall |
Time |
4월 19일 (목요일) 11:00~12:30 |
Code |
IND.P-18 |
Subject |
Influence of electroless nickel plating on electromagnetic interference shielding effectiveness and tensile properties of copper-polyacrylonitrile fibers |
Authors |
Yoon-Ji Yim, Soo-Jin Park* Department of Chemistry, Inha University, Korea |
Abstract |
In this study, highly conductive Ni/Cu-polyacrylonitrile (PAN) fibers were prepared by electroless nickel plating on Cu-PAN fibers. In addition, the electromagnetic interference (EMI) shielding properties of the Ni/Cu-PAN fibers were investigated by varying the nickel plating time. The surface morphology of the Ni/Cu-PAN fibers was observed with a scanning electron microscope (SEM) in order to determine its surface properties and the volume resistivity of the samples was measured by using a four-point probe electrical resistivity tester to evaluate its electric properties. The electromagnetic interference shielding effectiveness (EMI-SE) was tested by a EMI shielding analyzer. Tensile test of the Ni/Cu-PAN were conducted using a universal test machine (UTM). The EMI-SE of Ni/Cu-PAN fibers was much improved compared with that of the as-received CuS-PAN fibers. In addition, the EMI-SE was found to increase as the nickel-plating time increased and the largest EMI-SE of about 45 dB was achieved at 2.15 GHz. Thus, it was found that the nickel plating time was a key factor in determining the EMI-SE of Ni/Cu-PAN fibers. |
E-mail |
yjyim@inha.edu |
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