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| Type |
Poster Presentation |
| Area |
Material Chemistry |
| Room No. |
Grand Ballroom |
| Time |
10월 18일 (목요일) 11:00~12:30 |
| Code |
MAT.P-370 |
| Subject |
New approach for fabricating the controllable high-resolution nanostructures by the combination of secondary sputtering phenomenon and electroplating process . |
| Authors |
Hwan-Jin Jeon
Department of Chemical Engineering & Biotechnology, Korea Polytechnic University, Korea |
| Abstract |
The development of large-area, high-resolution nanostructure patterning with high aspect ratios is a challenging problem that must be addressed for potential applications in high performance nanoscale devices, such as nanoelectronics, optics, microfluidics, organic solar cell, display devices and biosensing devices.
We fabricated size-controllable 3D patterned nanostructures with a wide range of resolutions (from ten nanometers to a few hundreds of nanometers) and a high aspect ratio over a large area through controlled plasma ion reactions and an electroplating process. This technique can produce various 3D patterns with ultrahigh resolution by utilizing (i) secondary sputtering during the plasma ion process, which can enable the fabrication of 3D structures on the 10 nm scale, and (ii) finely controlled electroplating (square-pulse-mode electroplating), which can control the resolution of structures through simple solution reactions by increasing the thickness of the original 10 nm-scale SSL-derived structures. Additionally, this technique can be extended to produce features with various 3D shapes (lines, hole-cylinders) from various other conductive materials (Cu, Al, Ag, etc.) on various types of substrates (silicon wafers, transparent glass, and flexible PC films). Accordingly, this new lithographic technique can serve as a next-generation patterning method for fabricating complex high-aspect-ratio patterned structures with ultrahigh resolution.
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| E-mail |
hjjeon@kpu.ac.kr |
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122nd General Meeting of the KCS